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preliminary data this is preliminary information on a new product now in development or undergoing evaluation. details are subject to change without notice. december 2011 doc id 022612 rev 1 1/24 24 l3g4is mems motion sensor: three-axis digital output gyroscope for gaming and ois features three selectable full-scales (250/500/2000 dps) for gaming applications 65 dps full-scale for ois applications independent i 2 c and spi digital interfaces embedded temperature sensor integrated low- and high-pass filters with user- selectable bandwidth wide supply voltage range: 2.4 v to 3.6 v low voltage-compatible ios (1.8 v) power-down and sleep mode for smart power saving embedded fifo (first-in first-out buffer) ecopack ? rohs and ?green? compliant applications gaming and virtual reality input devices optical image stabilization motion control and gesture recognition gps navigation systems description the l3g4is is the first three-axis mems gyroscope that enables both user interface and image stabilization applications at the same time. thanks to two different independent reading chains and digital interfaces, the l3g4is delivers previously unseen levels of flexibility to the end user. each reading chain and the corresponding full- scale can be activated by powering two separate pins, the internal asic blocks automatically detect and enable the selected device configuration. the unique sensing element is manufactured using a dedicated micro-machining process developed by stmicroelectronics to produce inertial sensors and actuators on silicon wafers. the l3g4is is available in a plastic land grid array (lga) package and can operate within a temperature range of -30 c to +85 c. lga-16 (4x4x1 mm) table 1. device summary order code temperature range (c) package packing l3g4is -30 to +85 lga-16 (4x4x1) tray L3G4ISTR -30 to +85 lga-16 (4x4x1) tape and reel www.st.com
contents l3g4is 2/24 doc id 022612 rev 1 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 working mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 user interface mode specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3 temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.4 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 image stabilization (ois mode) specifications . . . . . . . . . . . . . . . . . . . 13 5.1 mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.3 temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.4 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.1 power supply configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.1.1 configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.1.2 configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.1.3 configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.1.4 configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
l3g4is list of tables doc id 022612 rev 1 3/24 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 4. mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 5. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 6. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 7. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 8. mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 9. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 10. electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 11. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 12. external components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 13. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
list of figures l3g4is 4/24 doc id 022612 rev 1 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. l3g4is electrical connections and external component values . . . . . . . . . . . . . . . . . . . . . 16 figure 4. l3g4is power supply configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 8 figure 5. l3g4is power supply configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 9 figure 6. l3g4is power supply configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 9 figure 7. l3g4is power supply configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 8. lga-16: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
l3g4is block diagram and pin description doc id 022612 rev 1 5/24 1 block diagram and pin description figure 1. block diagram 1.1 pin description figure 2. pin connection am102 3 4v1 mem s s en s or mux mux c - converter v s c filter adc di g ital filter s s pi bw s election actuation interface c - converter v s c filter adc di g ital filter s i2c bw s election actuation interface full s cale s election fifo oi s readin g chain ui readin g chain am102 3 5v1 (top view) direction s of the detectable angular rate s x vdd_io_ s pi s cl s da gnd c s _oi s s cl_oi s s di/ s do_oi s re s int drdy re s re s c a p havdd avdd reg 1 8 12 5 4 9 1 3 16 + z + x bottom view + y
block diagram and pin description l3g4is 6/24 doc id 022612 rev 1 table 2. pin description pin# name function 1 vdd_io_spi power supply for i/o pins of the pspi interface 2scli 2 c serial clock (scl) 3sdai 2 c serial data (sda) 4 gnd 0 v power supply 5 reserved leave unconnected 6 drdy data ready signal (open drain pad) 7 int programmable interrupt (open drain pad) 8 reserved leave unconnected 9 reserved leave unconnected 10 sdi/sdo_ois data-in, data-out line for spi interface 11 scl_ois clock line for spi interface 12 cs_ois spi chip select line 13 reg capacitance connection pin for internal regulator 14 cap capacitance connection pin for internal charge pump 15 havdd power supply for ois mode 16 avdd power supply for user interface mode
l3g4is terminology doc id 022612 rev 1 7/24 2 terminology 2.1 sensitivity an angular rate gyroscope is a device that produces a positive-going digital output for counter-clockwise rotation around the sensitive axis considered. sensitivity describes the gain of the sensor and can be determined by applying a defined angular velocity to it. this value changes very little over temperature and time. 2.2 zero-rate level zero-rate level describes the actual output signal if there is no angular rate present. the zero-rate level of precise mems sensors is, to some extent, a result of stress to the sensor and therefore the zero-rate level can slightly change after mounting the sensor onto a printed circuit board or after exposing it to extensive mechanical stress. this value changes very little over temperature and time.
working mode selection l3g4is 8/24 doc id 022612 rev 1 3 working mode selection the l3g4is can be used for user interface and image stabilization applications. depending on the power supply provided and dedicated internal bits configuration, the l3g4is is able to keep both reading chains active allowing the user to exploit the advantages of high resolution on low full-scale and low current consumption on high full-scale at the same time through spi and i 2 c digital interfaces. when either avdd or havdd are removed they must be connected to gnd for proper working of the device. table 3. operating mode avdd avdd_ois operating mode i2c interface spi interface off off gyro off not available not available on off ui read/write ui registers not available off on ois not available read/write ois registers on on ois/ui read/write ui registers read/write ois registers
l3g4is user interface mode specifications doc id 022612 rev 1 9/24 4 user interface mode specifications 4.1 mechanical characteristics @ avdd = 2.8 v, t = 25 c unless otherwise noted (a) . a. the product is factory calibrated at 3.3 v. the operational power supply range is specified in table 5 . table 4. mechanical characteristics symbol parameter test condition min. typ. (1) max. unit fs measurement range user selectable 250 dps 500 2000 so sensitivity fs = 250 dps 8.75 mdps/digit fs = 500 dps 17.50 fs = 2000 dps 70 sodr sensitivity change vs. temperature from -30 c to +85 c delta from t = 25 c 2 % dvoff digital zero-rate level fs = 250 dps 25 dps fs = 500 dps 25 fs = 2000 dps 25 offdr zero-rate level change vs. temperature fs = 250 dps 0.03 dps/c fs = 2000 dps 0.04 dps/c nl non linearity (2) best fit straight line 0.2 % fs rn rate noise density 0.015 bw system bandwidth 140 hz ton turn-on time from power-down to normal mode 60 ms odr digital output data rate 95/190/ 380/760 hz top operating temperature range -30 +85 c 1. typical specifications are not guaranteed. 2. guaranteed by design. dps hz ( ?
user interface mode specifications l3g4is 10/24 doc id 022612 rev 1 4.2 electrical characteristics @ avdd = 2.8 v, t = 25 c unless otherwise noted (b) . b. the product is factory calibrated at 3.3 v. table 5. electrical characteristics symbol parameter test condition min. typ. (1) max. unit avdd supply voltage 2.42 2.8 3.6 v vdd_io_ui supply voltage for ui digital pins internal voltage reference 1.62 1.8 1.98 v vddi2cbus supply voltage i 2 c bus allowed supply voltage for ui i 2 c bus 1.62 1.8 1.98 v idd supply current 6 ma iddsl supply current in sleep mode (2) selectable by digital interface 3.2 ma iddpdn supply current in power-down mode selectable by digital interface 20 a vih digital high level input voltage 0.7*vdd_io_ui vdd_io_ui vdd_io_ui + 0.3 v vil digital low level input voltage -0.3 0 0.3*vdd_io_ui v voh digital high level output voltage int/drdy signals 0.65*vdd_io_ui vdd_io_ui vdd_io_ui + 0.3 v vol digital low level output voltage int/drdy signals -0.3 0 0.35*vdd_io_ui v top operating temperature range -30 +85 c 1. typical specifications are not guaranteed. 2. sleep mode introduces a faster turn-on time related to power-down mode.
l3g4is user interface mode specifications doc id 022612 rev 1 11/24 4.3 temperature sensor characteristics @ avdd = 2.8 v, t = 25 c unless otherwise noted (c) . 4.4 absolute maximum ratings stresses above those listed as ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. c. the product is factory calibrated at 3.3 v. table 6. electrical characteristics symbol parameter test condition min. typ. (1) max. unit tsdr temperature sensor output change vs. temperature - -1 c/digit todr temperature refresh rate 1 hz to p operating temperature range -30 +85 c 1. typical specifications are not guaranteed. table 7. absolute maximum ratings (1) 1. supply voltage on any pin should never exceed 4.8 v. symbol ratings maximum value unit avdd supply voltage -0.3 to 4.8 v havdd supply voltage -0.3 to 4.8 v vdd_io_spi vdd io spi interface -0.3 to havdd +0.1 v vin(ui) input voltage on: (scl, sda, int, drdy) -0.3 to avdd +0.1 v vin(ois) input voltage on: (cs_ois, sdi/sdo_ois, scl_ois) -0.3 to vdd_io_spi +0.1 v t stg storage temperature range -40 to +125 c sg acceleration g for 0.1 ms 10,000 g esd electrostatic discharge protection 2 (hbm) kv 1.5 (cdm) kv 200 (mm) v
user interface mode specifications l3g4is 12/24 doc id 022612 rev 1 this is a mechanical shock sensitive device, improper handling can cause permanent damage to the part. this is an esd sensitive device, improper handling can cause permanent damage to the part.
l3g4is image stabilization (ois mode) specifications doc id 022612 rev 1 13/24 5 image stabilization (ois mode) specifications 5.1 mechanical characteristics @ havdd = 3.3 v, t = 25 c unless otherwise noted (d) . d. the product is factory calibrated at 3.3 v. the operational power supply range is specified in table 5 . table 8. mechanical characteristics symbol parameter test condition min. typ. (1) max. unit fs measurement range 65 dps so sensitivity 225 lsb/dps sodr sensitivity change vs. temperature from -30 c to +85 c 5 % dvoff digital zero-rate level high pass filter disabled 75 dps high pass filter enabled 20 offdr zero-rate level change vs. temperature high pass filter disabled 25 dps high pass filter enabled 10 nl non linearity (2) best fit straight line 1 % fs rn rate noise density (2) 0.008 bw internal bandwidth lpf0 set to ?1? 370 hz phdl phase delay at 20 hz (370 hz bw selected) 4.5 deg odr digital output data rate 9.5 khz top operating temperature range -30 +85 c 1. typical specifications are not guaranteed. 2. guaranteed by design. dps hz ( ?
image stabilization (ois mode) specifications l3g4is 14/24 doc id 022612 rev 1 5.2 electrical characteristics @ havdd = 3.3 v, t = 25 c unless otherwise noted (e) . 5.3 temperature sensor characteristics @ havdd = 3.3 v, t = 25 c unless otherwise noted (f) . e. the product is factory calibrated at 3.3 v. table 9. electrical characteristics symbol parameter test condition min. typ. (1) max. unit havdd supply voltage 3.0 3.3 3.6 v vdd_io_spi i/o pins supply voltage (2) 1.71 havdd+0 .1 v idd supply current ois and ui modes active 10 ma iddsl supply current in sleep mode (3) selectable by digital interface 3.2 ma iddpdn supply current in power- down mode selectable by digital interface 20 a vih digital high level input voltage 0.8*vdd_i o_spi v vil digital low level input voltage 0.2*vdd_i o_spi v to p operating temperature range -30 +85 c 1. typical specifications are not guaranteed. 2. it is possible to remove havdd maintaining vdd_io_spi wi thout blocking the communication busses, in this condition the measurement chain is powered off. 3. sleep mode introduces a faster turn-on time related to power-down mode. f. the product is factory calibrated at 3.3 v. table 10. electrical characteristics symbol parameter test condition min. typ. (1) max. unit tsdr temperature sensor output change vs. temperature - -1 c/digit todr temperature refresh rate 1 hz to p operating temperature range -30 +85 c 1. typical specifications are not guaranteed.
l3g4is image stabilization (ois mode) specifications doc id 022612 rev 1 15/24 5.4 absolute maximum ratings stresses above those listed as ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. table 11. absolute maximum ratings (1) 1. supply voltage on any pin should never exceed 4.8 v. symbol ratings maximum value unit avdd supply voltage -0.3 to 4.8 v havdd supply voltage -0.3 to 4.8 v vdd_io_ spi vdd io spi interface -0.3 to havdd +0.1 v vin(ui) input voltage on: (scl, sda, int, drdy) -0.3 to avdd +0.1 v vin(ois) input voltage on: (cs_ois, sdi/sdo_ois, scl_ois) -0.3 to vdd_io_spi +0.1 v t stg storage temperature range -40 to +125 c sg acceleration g for 0.1 ms 10,000 g esd electrostatic discharge protection 2 (hbm) kv 1.5 (cdm) kv 200 (mm) v this is a mechanical shock sensitive device, improper handling can cause permanent damage to the part. this is an esd sensitive device, improper handling can cause permanent damage to the part.
application hints l3g4is 16/24 doc id 022612 rev 1 6 application hints figure 3. l3g4is electrical connections and external component values table 12. external components type description value purpose c1 = c3 1 f decoupling c2 = c4 100 pf decoupling c5 (1) 1. this value must guarantee a minimum of 1 nf value under 11 v bias condition. 10 nf (25 v class) charge pump c6 220 nf (5 v class) internal regulator rpu 10 k avdd gnd c6 gnd s cl drdy gnd s da vdd_io_ s pi avdd 1 8 12 5 49 1 3 16 top view int (top view) direction s of the detectable angular rate s x + z + x + y rp u = 10kohm rp u s cl s da p u ll- u p to b e a dded on i2c line s 14 gnd s cl_oi s c s _oi s s di/ s do_oi s re s re s re s reg c5 c a p c1 c2 c4 c 3 havdd havdd vddi2c bus rp u = 10kohm rp u int drdy p u ll- u p to b e a dded on int a nd drdy s ign a l s vddi2c bus am102 3 6v1
l3g4is application hints doc id 022612 rev 1 17/24 power supply decoupling capacitors (100 pf + 1 f) should be placed as near as possible to the device (common design practice). pull-up resistors must be added to i 2 c sda and scl lines and to int and drdy lines.
application hints l3g4is 18/24 doc id 022612 rev 1 6.1 power supply configurations the l3g4is can be powered according to several different configurations, as reported in section 3 . depending on the particular power supply provided, either the user interface or image stabilization modes are activated. the presence of a certain power supply determines also which digital interface is available. in figure 4 three possible power supply configurations are reported to further explain the high level of flexibility allowed by the component. it should be noted that when avdd and havdd are removed they must be connected to gnd for proper working of the device. 6.1.1 configuration 1 figure 4. l3g4is power supply configuration 1 where: avdd is on havdd is on ui and ois modes enabled i 2 c (scl/sda) is supplied by avdd) drdy/int are supplied by avdd vdd_io_spi can be connected to any voltage in the range of 1.71 v to havdd. note: for complete external component placement please refer to figure 3: l3g4is electrical connections and external component values . s cl drdy gnd s da vdd_io_ s pi avdd 1 8 12 5 49 1 3 16 top view int rp u = 10kohm rp u s cl s da p u ll- u p to b e a dded on i2c line s 14 s cl_oi s c s _oi s s di/ s do_oi s re s re s re s reg c a p havdd avdd havdd rp u = 10kohm rp u int drdy vddi2c bus vddi2c bus am102 3 7v1
l3g4is application hints doc id 022612 rev 1 19/24 6.1.2 configuration 2 figure 5. l3g4is power supply configuration 2 where: avdd is off havdd is on ois mode enabled i 2 c (scl/sda) is not available vdd_io_spi has been shorted to havdd: spi is now powered by havdd. note: for complete external component placement please refer to figure 3: l3g4is electrical connections and external component values . 6.1.3 configuration 3 figure 6. l3g4is power supply configuration 3 s cl drdy gnd s da vdd_io_ s pi avdd 1 8 12 5 49 1 3 16 top view 14 s cl_oi s c s _oi s s di/ s do_oi s re s re s re s reg c a p havdd havdd gnd int am102 38 v1 s cl drdy gnd s da vdd_io_ s pi avdd 1 8 12 5 49 1 3 16 top view 14 s cl_oi s c s _oi s s di/ s do_oi s re s re s re s reg c a p havdd havdd avdd int rp u = 10kohm rp u s cl s da p u ll- u p to b e a dded on i2c line s vddi2c bus rp u = 10kohm rp u int drdy p u ll- u p to b e a dded on int a nd drdy s ign a l s vddi2c bus am102 3 9v1
application hints l3g4is 20/24 doc id 022612 rev 1 where: avdd is on havdd is on ois mode enabled ui mode enabled i 2 c (scl/sda) is available (internally powered at 1.8 10% drdy/int are available vdd_io_spi has been shorted to havdd: spi is now powered by havdd. note: for complete external component placement please refer to figure 3: l3g4is electrical connections and external component values . 6.1.4 configuration 4 (case use) figure 7. l3g4is power supply configuration 4 (case use) note: for complete external component placement please refer to figure 3: l3g4is electrical connections and external component values . s cl drdy gnd s da avdd 1 8 12 5 49 1 3 16 top view 14 s cl_oi s c s _oi s s di/ s do_oi s re s re s re s reg c a p havdd havdd avdd int gyro oi s controller rp u = 10kohm rp u ho s t ui rp u = 10kohm rp u vddi2c bus vddi2c bus am10240v1
l3g4is soldering information doc id 022612 rev 1 21/24 7 soldering information the lga package is compliant with the ecopack ? , rohs and ?green? standard. it is qualified for soldering heat resistance according to jedec j-std-020. leave ?pin 1 indicator? unconnected during soldering. land pattern and soldering recommendations are available at www.st.com/mems .
package information l3g4is 22/24 doc id 022612 rev 1 8 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack specifications, grade definitions and product status are available at: www.st.com. ecopack is an st trademark. figure 8. lga-16: mechanical data and package dimensions dimen s ion s ref. mm inch min. typ. max. min. typ. max. a1 1.000 0.0 39 4 a2 0.7 8 50.0 3 0 9 a 3 0.200 0.007 9 d0. 3 00 0.011 8 d1 3 . 8 50 4.000 4.150 0.1516 0.1575 0.16 3 4 e1 3 . 8 50 4.000 4.150 0.1516 0.1575 0.16 3 4 l2 1. 9 50 0.076 8 m 0.100 0.00 39 n1 0.650 0.0256 n2 0. 9 75 0.0 38 4 p1 1.750 0.06 89 p2 1.525 0.0600 t1 0.400 0.0157 t2 0. 3 00 0.011 8 k 0.050 0.0020 lga-16 (4x4x1mm) land grid array packa g e outline and 8 1250 9 7_a mechanical data
l3g4is revision history doc id 022612 rev 1 23/24 9 revision history table 13. document revision history date revision changes 22-dec-2011 1 initial release.
l3g4is 24/24 doc id 022612 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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